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发表于 2015-7-16 12:28:34
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2015年SCQI得奖供应商11家,其中日企9家、美企1家、韩企1家。
•美国卡博特微电子(Cabot Microelectronics):化学机械研磨浆料和保护垫 (CMP slurries and CMP pads)
•韩国大元半导体包材工业(Daewon Semiconductor Packaging Industrial):用于裸片组装测试和运输的塑料托架 (plastic injection molded tray (PIMT) media for bare die automation, substrate transport, device assembly and test, final shipping and storage, bare die tape and reel (BDTR) media for bare die transport)
•日本日立高新技术(Hitachi High-Technologies):干刻蚀、物理灰化、测量和先进封装系统 (dry etching, ashing, metrology and advanced packaging systems)
•日本日立国际电气(Hitachi Kokusai Electric):热镀膜处理成套系统 (thermal thin film processing solution system)
•日本揖斐电(IBIDEN):芯片封装基板材料 (substrate packaging materials)
•日本捷时雅(JSR):先进光阻、封装和化学机械研磨材料 (advanced photoresists, packaging materials and CMP Materials)
•日本多摩化学工业(Moses Lake Industries,Tama Chemicals):电镀、光刻和清洗用试剂化学品 (plating, lithography, cleans and reagent chemicals)
•日本村田制作所(Murata Manufacturing):积层电容、电感、EMI部件、SAW滤波器和射频模块 (multilayer ceramic capacitors, inductors and electromagnetic interference components, SAW filters, and RF modules)
•日本千住金属工业(Senju Metal Industry):焊料 (soldering materials)
•日本胜高(SUMCO):200mm和300mm晶圆片 (200mm and 300mm epitaxial and polished silicon wafers)
•日本东曹石英(Tosoh Quartz):用于晶圆处理工序的石英制品 (quartzware for semiconductor wafer processing equipment)
2015年PQS得奖供应商19家,其中日企11家、美企4家、德法荷台企业各1家。
•美国安靠科技(Amkor Technology):晶圆测试和封装服务 (wafer probe, wafer bump, assembly, final testing services)
•美国应用材料(Applied Materials):晶圆和光罩设备、工厂自动化设备及服务 (wafer fab capital equipment, mask capital equipment, fab automation software and services)
•荷兰阿斯麦尔(ASML):光刻系统 (semiconductor lithography equipment)
•日本大福(Daifuku):自动化物料搬运系统 (automated material handling systems)
•美国应特格(Entegris):污染物控制、电路材料和先进制程材料 (contamination control, critical materials handling and advanced process materials)
•日本富士胶片电气材料(Fujifilm Electronic Materials:工序和配方化学品、研磨液、沉积和光阻材料 (process and formulated chemicals, developers, slurry, precursors and resist)
•日本不二见(Fujimi):化学机械研磨和晶圆研磨用浆料 (chemical mechanical planarization and silicon polishing slurries)
•日本三菱瓦斯化学(Mitsubishi Gas Chemical):高纯度过氧化物和定制化后端清洗 (high purity peroxide and custom back end cleans)
•美国麦迪实(ModusLink Global Solutions):盒装CPU分销管理 (channel box CPU for Penang, Shanghai, Miami and finished goods warehouse distribution for Miami)
•日本村田机械(Murata Machinery):自动化物料搬运系统的部件 (automated material handling systems, hoist vehicles and stockers)
•日本尼康(Nikon):用于开发和高产量的半导体光刻系统 (semiconductor lithography systems for technology development and high volume manufacturing)
•日本信越半导体(Shin Etsu Handotai):晶圆片 (silicon wafers)
•日本新光电气工业(Shinko Electric Industries):塑料层压积板和散热器 (plastic laminated packages and heat spreaders)
•台湾矽品精密工业(Siliconware Precision Industries):半导体封测服务 (semiconductor assembly and test services)
•德国世创(Siltronic):晶圆片 (polished and epitaxial silicon wafers)
•日本太阳诱电(Taiyo Yuden):积层电容、电感和滤波器 (ceramic capacitors, inductors, and filters)
•日本东京电子(Tokyo Electron Limited):干湿刻蚀系统、热处理系统、镀膜和测试系统 (coater/developer, dry etch systems, wet etch systems, thermal processing systems, deposition systems and test systems)
•日本东京应用化学(Tokyo Ohka Kogyo):高纯度光阻及清洗成套设备 (high purity photo resists, developers, cleaning solutions and supporting chemistries)
•法国威立雅北美(Veolia North America):废弃物管理 (waste management services)
“供应商成就奖”则由荷兰和美国企业夺得。
•荷兰阿司麦(ASM International):前工序设备制造 (front end equipment manufacturer)
•美国通用电器-水处理科技(GE Water and Process Technologies):超纯水和废水循环再用及其服务 (UPW & wastewater recycle/reuse equipment and services) |
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